AT93C46Y6-10YH-1.8 View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT93C46Y6-10YH-1.8' PDF : 18 Pages View PDF
AT93C46 Ordering Information(1)
Ordering Code
Package
Operation Range
AT93C46-10PU-2.7(2)
AT93C46-10PU-1.8(2)
AT93C46-10SU-2.7(2)
AT93C46-10SU-1.8(2)
AT93C46W-10SU-2.7(2)
AT93C46W-10SU-1.8(2)
AT93C46-10TU-2.7(2)
AT93C46-10TU-1.8(2)
AT93C46Y1-10YU-1.8(2) (Not recommended for new
designs)
AT93C46Y6-10YH-1.8(3)
AT93C46U3-10UU-1.8(2)
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8Y1
8Y6
8U3-1
Lead-free/Halogen-free/
Industrial Temperature
(−40°C to 85°C)
AT93C46-W1.8-11(4)
Die Sale
Industrial
(−40°C to 85°C)
Notes:
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the Table 3 on page 3 and Table 4
on page 4. Not recommended for new design. Please refer to AT93C46D datasheet.
2. “U” designates Green Package and RoHS compliant.
3. “H” designates Green Package and RoHS compliant, with NiPdAu Lead finish
4. Available in waffle pack and wafer form, order as SL788 for inkless wafer form. Bumped die available upon request.
8P3
8S1
8S2
8A2
8U3-1
8Y1
8Y6
−2.7
−1.8
R
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-ball, Die Ball Grid Array Package (dBGA2)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50mm Pitch, Ultra-Thin Mini-MAO, Dual No Lead Package. (DFN), (MLP
2x3mm)
Options
Low Voltage (2.7V to 5.5V)
Low Voltage (1.8V to 5.5V)
Rotated Pinout
10 AT93C46
5140B–SEEPR–2/07
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