Thus, for reliable operation of ATF-521P8 and extended
MTBF, it is recommended to use some form of thermal
heatsinking. This may include any or all of the following
suggestions:
• Maximize vias underneath and around package;
• Maximize exposed surface metal;
• Use 1 oz or greater copper clad;
• Minimize board thickness;
• Metal heat sinks or extrusions;
• Fans or forced air;
• Mount PCB to Chassis.
Summary
A high linearity Tx driver amplifier for WCDMA has been
presented and designed using Agilent’s ATF-521P8. This
includes RF, DC and good thermal dissipation practices
for reliable lifetime operation. A summary of the typical
performance for ATF-521P8 demoboard at 2140 MHz is
as follows:
Demo Board Results at 2140 MHz
Gain
16.5 dB
OIP3
41.2 dBm
ACLR -58 dBc
P1dB
24.8 dBm
NF
1.55 dB
References
[1] Ward, A. (2001) Avago Technologies ATF‑54143 Low
Noise Enhancement Mode Pseudomorphic HEMT in a
Surface Mount Plastic Package, 2001 [Internet], Avail‑
able from:
<http://www.avagotech.com>
[2] Biasing Circuits and Considerations for GaAs MES-
FET Power Amplifiers, 2001 [Internet], Available from:
<http://www.rf-solutions.com/pdf/AN‑0002_ajp.pdf>
[Accessed 22 August, 2002]
Device Models
Refer to Avago Technologies' Web Site:
www.avagotech.com
Ordering Information
Part Number
No. of Devices
ATF-521P8-TR1
ATF-521P8-TR2
ATF-521P8-BLK
3000
10000
100
Container
7” Reel
13”Reel
antistatic bag
2 x 2 LPCC (JEDEC DFP-N) Package Dimensions
D1
D
P
pin1
pin1
1
E1
e
R
2 2PX
3
4
8
7
E
6
5
L
b
Bottom View
Top View
A A1
A2
End View
A
End View
DIMENSIONS
SYMBOL
A
A1
A2
b
D
D1
E
E1
e
MIN.
0.70
0
0.225
1.9
0.65
1.9
1.45
NOM.
0.75
0.02
0.203 REF
0.25
2.0
0.80
2.0
1.6
0.50 BSC
MAX.
0.80
0.05
0.275
2.1
0.95
2.1
1.75
DIMENSIONS ARE IN MILLIMETERS
21