ATSGA204A View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'ATSGA204A' PDF : 93 Pages View PDF
ATSHA204A
Package Drawings
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
G2
8
ØV
C Y2
G1
SILK SCREEN
12
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
Contact Pad to Center Pad (X8)
G1
Contact Pad to Contact Pad (X6) G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.50 BSC
1.60
1.40
2.90
0.30
0.85
0.20
0.33
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-21355-Q4B Rev A
© 2017 Microchip Technology Inc.
© 2018 Microchip Technology Inc.
DS40002025A-page 71
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