NXP Semiconductors
8. Package outline
Plastic surface-mounted package; 3 leads
D
BSR56; BSR57; BSR58
N-channel FETs
SOT023
B
E
A
X
3
1
e1
bp
e
2
wB
HE
vA
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
A A1 bp c D E e e1 HE Lp Q v w
max 1.1 0.1 0.48 0.15 3.0 1.4
2.5 0.45 0.55
mm nom
1.9 0.95
0.2 0.1
min 0.9
0.38 0.09 2.8 1.2
2.1 0.15 0.45
Outline
version
IEC
SOT023
References
JEDEC
JEITA
TO-236AB
Fig 4. Package outline SOT23 (TO-236AB)
BSR56_57_58
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 25 June 2014
European
projection
sot023_po
Issue date
06-03-16
14-06-19
© NXP Semiconductors N.V. 2014. All rights reserved.
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