C1093 View Datasheet(PDF) - Renesas Electronics
Part Name
Description
MFG CO.
'C1093' PDF : 16 Pages View PDF
µPC1093
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Through-hole device
µPC1093J: 3-pin plastic SIP (TO-92)
Process
Wave soldering
(only to leads)
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Conditions
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
Surface mount devices
µPC1093G: 8-pin plastic SOP (225 mil)
Process
Infrared ray reflow
VPS
Wave soldering
Conditions
Peak temperature: 230 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time.
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time.
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Symbol
IR30-00-1
VP15-00-1
WS60-00-1
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
12
Share Link: 
