CF5073BX View Datasheet(PDF) - Nippon Precision Circuits
Part Name
Description
MFG CO.
'CF5073BX' PDF : 14 Pages View PDF
PAD LAYOUT
(Unit: µm)
CF5073 series
XTN XT
7
6
(1240,1400)
VC 1
HA5073
INHN 2
3
(0,0)
VSS
5 VDD
4Q
Chip size: 1.24 × 1.4mm
Chip thickness: 300 ± 30µm
Chip base: VDD potential
PAD DESCRIPTION AND DIMENSIONS
Pad No. Name
1
VC
2
INHN
3
VSS
4
Q
5
VDD
6
XT
7
XTN
I/O
Description
Function
Pad dimensions [µm]
X
Y
I
Oscillation frequency control Positive polarity (frequency increases with
voltage input pin
increasing voltage)
134
915
I
Output state control voltage High-impedance output when LOW, pull-up
input pin
resistor built-in
137
295
–
(−) supply pin
458
137
O
Output pin
–
(+) supply pin
Output frequency determined by internal
circuit to one of fO, fO/2, fO/4, fO/8, fO/16, fO/32
1086
155
1106
772
I
Amplifier input pin
O
Amplifier output pin
Crystal connection pins.
829
1263
Crystal is connected between XT and XTN.
416
1260
NIPPON PRECISION CIRCUITS INC.—2
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