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CHA2157-99F View Datasheet(PDF) - United Monolithic Semiconductors

Part Name
Description
MFG CO.
CHA2157-99F
UMS
United Monolithic Semiconductors UMS
'CHA2157-99F' PDF : 6 Pages View PDF
1 2 3 4 5 6
55-60GHz Low Noise Amplifier
Chip Assembly and Mechanical Data
CHA2157
Note: Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.
Bonding pad positions.
(Chip thickness: 100µm. All dimensions are in micrometers)
Ref. : DSCHA21577150 - 30 May 07
5/6
Specifications subject to change without notice
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