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CHA2190-99F View Datasheet(PDF) - United Monolithic Semiconductors

Part Name
Description
MFG CO.
CHA2190-99F
UMS
United Monolithic Semiconductors UMS
'CHA2190-99F' PDF : 8 Pages View PDF
1 2 3 4 5 6 7 8
20-30GHz Low Noise Amplifier
Typical Chip Assembly
CHA2190
- * Nominal Input and Output bonding lenght: 0.3 to 0.38nH for one 25µm bond wire.
- Chip backside is DC and RF grounded
Chip Biasing options
Ref :DSCHA21902036 -05-Feb.-02
7/8
Specifications subject to change without notice
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