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CHA2291-99F View Datasheet(PDF) - United Monolithic Semiconductors

Part Name
Description
MFG CO.
CHA2291-99F
UMS
United Monolithic Semiconductors UMS
'CHA2291-99F' PDF : 6 Pages View PDF
1 2 3 4 5 6
10-18GHz LNA VGA
CHA2291
Chip Assembly and Mechanical Data
To V5 DC drain supply feed
To Vd2,3,4 DC drain supply feed
120pF
120pF
RF IN
RF OUT
120pF
120pF
120pF
To Vg1 DC gate supply feed
To Vc DC supply feed
To Vg2,3,4 DC gate supply feed
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bond Pad:100 x 100 µm
Bonding pad positions
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA22912149 - 29-May-02
5/6
Specifications subject to change without notice
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