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CHA2292-99F View Datasheet(PDF) - United Monolithic Semiconductors

Part Name
Description
MFG CO.
CHA2292-99F
UMS
United Monolithic Semiconductors UMS
'CHA2292-99F' PDF : 6 Pages View PDF
1 2 3 4 5 6
17-24GHz LNA VGA
Chip Assembly and Mechanical Data
234
234
CHA2292
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bond Pad:100 x 100 µm
Bonding pad positions
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA22927150 - 20 May 07
6/7
Specifications subject to change without notice
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