CHA3063-99F View Datasheet(PDF) - United Monolithic Semiconductors

Part Name

Description

MFG CO.

CHA3063-99F

5.5-23GHz Driver Amplifier

United Monolithic Semiconductors 

1 2 3 4 5 6 7

CHA3063

5.5-23GHz Driver Amplifier

Chip Assembly and Mechanical Data

Note :Supply feed should be capacitively bypassed. 25µm diameter gold wire is

recommended

Bonding pad positions.

( Chip thickness : 100µm. All dimensions are in micrometers)

Ref : DSCHA30632263 -20-Sept.-02

6/7

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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