CHA4042-99F View Datasheet(PDF) - United Monolithic Semiconductors

Part Name

Description

MFG CO.

CHA4042-99F

23–34GHz High Power Amplifier

United Monolithic Semiconductors 

1 2 3 4 5 6

CHA4042

23-34GHz High Power Amplifier

MMIC Outline & Bond Pads

Not to scale, dimensions are in millimeters

14

13 12 11 10

1.090

.338

15

123

.000

45

6

9

.467

8

.240

7

Bond Pad #1, 7, 9: GND

Bond Pad #4, 5, 11: GND

Bond Pad #14: GND

Bond Pad #2: VG1

Bond Pad #3: VG2

Bond Pad #6: VG3

Bond Pad #8: RF OUT

Bond Pad #10: VD3

Bond Pad #12: VD2

Bond Pad #13: VD1

Bond Pad #15: RF IN

(0.080 x 0.080)

(0.080 x 0.090)

(0.122 x 0.080)

(0.100 x 0.150)

(0.100 x 0.150)

(0.100 x 0.100)

(0.100 x 0.260)

(0.100 x 0.100)

(0.100 x 0.100)

(0.100 x 0.100)

(0.100 x 0.200)

Units: millimeters

Thickness: 0.070

Chip size : 1930µm +/-35µm x 1090µm +/- 35µm

Ref. : DSCHA40422218 -06-Aug.-02

4/6

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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