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CHA5093-99F View Datasheet(PDF) - United Monolithic Semiconductors

Part Name
Description
MFG CO.
CHA5093-99F
UMS
United Monolithic Semiconductors UMS
'CHA5093-99F' PDF : 8 Pages View PDF
1 2 3 4 5 6 7 8
CHA5093
22-26GHz High Power Amplifier
Chip Assembly and Mechanical Data
To Vg1,2,3 DC Gate supply feed
1nF
To Vd3 DC Drain supply feed
100pF
100pF
Out
In
100pF
100pF
To Vd1,2 DC Drain supply feed To Vd3 DC Drain supply feed
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA50930129 -09 May-00
6/8
Specifications subject to change without notice
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