CHA5294-99F/00 View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
MFG CO.
'CHA5294-99F/00' PDF : 6 Pages View PDF
30-40GHz Medium Power Amplifier
Bonding pad positions
( Chip thickness : 70µm)
CHA5294
Ref. : DSCHA52948205 - 23 Jul 08
5/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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