CHA5295-99F View Datasheet(PDF) - United Monolithic Semiconductors

Part Name

Description

MFG CO.

CHA5295-99F

24.5-26.5GHz High Power Amplifier

United Monolithic Semiconductors 

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CHA5295

24.5-26.5GHz High Power Amplifier

Bonding pad positions.

( Chip thickness : 50µm)

Application note

Due to 50µm thickness, specific care is requested for the handling and assembly.

Bias operation sequence:

ON: Supply Gate voltage

Supply Drain voltage

OFF: Cut off Drain voltage

Cut off Gate voltage

Ref. : DSCHA52953125 - 05 May 03

8/9

Specifications subject to change without notice

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Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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