CHA6042-99F View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
MFG CO.
'CHA6042-99F' PDF : 6 Pages View PDF
CHA6042
13-16GHz High Power Amplifier
MMIC Outline & Bond Pads
Not to scale, dimensions are in millimeters
1.36
±0.35
23
1
4
5
6
1
9
8
7
2.34 ±0.35
Bond Pad
Symbol
1
RF input
2
Vd1
3
Vd2
4
Vd3
5
Vd4
6
RF output
7
Vg4
8
Vg3
9
Vg2
10
Vg1
x-dim.
(um)
100
100
100
150
200
100
100
100
100
100
y-dim.
(um)
200
100
100
100
100
200
100
100
100
100
x-center
(um)
115
305
470
1280
1775
2235
1630
1310
920
525
y-center
(um)
835
1255
1255
1255
1255
785
105
105
105
105
Chip size : 2340µm +/-35µm x 1360µm +/- 35µm
Ref. : DSCHA6042218 - 06-Aug.-02
4/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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