CM201212-5N6M View Datasheet(PDF) - Bourns, Inc
Part Name
Description
MFG CO.
'CM201212-5N6M' PDF : 7 Pages View PDF
CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
Packaging Specifications
CM10, CM16, CM20, CM25, CM32
t1
E
flDo
P3
CM45
t1
E
flDo
P3
F
W
t2
Chip
Component
B
D1
DIA.
P2
P1
A
Tape running direction
F
W
t2
Chip
Component
B
P2
P1
A
Tape running direction
Model
CM10
CM16
CM20
CM25
CM32
CM45
A
0.71 (.027)
1.00 (.039)
1.45 (.057)
2.40 (.094)
2.80 (.110)
3.60 (.142)
B
1.21 (.047)
1.80 (.071)
2.25 (.089)
2.90 (.114)
3.60 (.142)
4.90 (.193)
W
F
8.00 (.315) 3.50 (.138)
8.00(.315) 3.50 (.138)
8.00(.315) 3.50 (.138)
8.00(.315) 3.50 (.138)
8.00(.315) 3.50 (.138)
12.00(.472) 5.50 (.217)
E
1.75 (.069)
1.75 (.069)
1.75 (.069)
1.75 (.069)
1.75 (.069)
1.75 (.069)
P1
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
8.00 (.315)
P2
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
P3
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
øD0
1.50 (.059)
1.50 (.059)
1.50 (.059)
1.50 (.059)
1.50 (.059)
1.50 (.059)
øD1
0.60 (.024)
0.60 (.024)
1.00 (.039)
1.10 (.043)
—
—
t1
0.27 (.011)
0.27 (.011)
0.25 (.010)
0.25 (.010)
0.25 (.010)
0.30 (.012)
t2
1.20 (.047)
1.20 (.047)
1.55 (.061)
1.85 (.073)
2.40 (.094)
3.50 (.138)
Reel Dimensions
Model
CM10
CM16
CM20
CM25
CM32
CM45
A
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
B
C
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
D
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
E
W
2 (.079) 9 (.354)
2 (.079) 9 (.354)
2 (.079) 9 (.354)
2 (.079) 9 (.354)
2 (.079) 9 (.354)
2 (.079) 13 (.512)
Packaging
Model
CM10
CM16
CM20
Quantity
10000 pcs
3000 pcs
3000 pcs
Weight
150g
90g
90g
Model
CM25
CM32
CM45
Quantity
2000 pcs
2000 pcs
500 pcs
Weight
100g
190g
100g
E
C
B
D
A
W
Soldering
Flow Soldering
Infra-red
Vapor-phase
260°C maximum for 5 seconds (2 wave solder method)
200°C for a maximum of 30 seconds. Peak of 240°C for a maximum of 5 seconds.
If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the
board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow.
215°C for a maximum of 30 seconds.
Flow Soldering
10 seconds max.
260°C
Preheat:
100 to 150°
2 minutes
min.
Specifications are subject to change without notice.
Infra-red Soldering
10 seconds max.
230°C
Preheat:
100 to 150°
2 minutes
min.
30 seconds max.
200°C
Vapor-phase Soldering
10 seconds max.
220°C
Preheat:
100 to 150°
2 minutes
min.
30 seconds max.
215°C
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