COM20019I3V-DZD View Datasheet(PDF) - SMSC -> Microchip
Part Name
Description
MFG CO.
'COM20019I3V-DZD' PDF : 70 Pages View PDF
Cost Competitive ARCNET (ANSI 878.1) Controller with 2K x 8 On-Chip RAM
9.2 48 Pin TQFP Package Outline and Parameters
MIN
NOMINAL
MAX
A
~
~
1.6
A1
0.05
0.10
0.15
A2
1.35
1.40
1.45
D
8.80
9.00
9.20
D/2
4.40
4.50
4.60
D1
6.90
7.00
7.10
E
8.80
9.00
9.10
E/2
4.40
4.50
4.60
E1
6.90
7.00
7.10
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00
~
e
0.50 Basic
θ
0o
~
7o
W
0.17
~
0.27
R1
0.08
~
~
R2
0.08
~
0.20
ccc
~
~
0.0762
ccc
~
~
0.08
Note 1: Controlling Unit: millimeter
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
SMSC COM20019I 3.3V
Page 65
DATASHEET
Rev. 10-31-06
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