COM20051I View Datasheet(PDF) - SMSC -> Microchip
Part Name
Description
MFG CO.
'COM20051I' PDF : 74 Pages View PDF
INDEX CORNER
D
D1
G x 45°
SEE DETAIL A
F x 45°
E E1
-E-
E3/D3 E2/D2
e
-D-
.007 E D
J x 45°, 3 places
DETAIL A
SEATING
B1
PLANE
B2
-C-
C
R
A1
A
.004
-C-
SEATING PLANE
B
DIM
A
A1
B
B1
B2
C
D/E
D1/E1
D2/E2
D3/E3
e
F
G
J
R
44 LEAD
.160-.188
.090-.120
.013-.021
.026-.032
.025 MIN
.020-.045
.685-.695
.650-.656
.600-.630
.500 REF
.050 BSC
.042-.060
.042-.048
.000-.028
.025-.045
Notes:
1. Dimensions are in inches.
2. Coplanarity is .004" maximum.
3. Tolerance on the position of the leads is .007" maximum.
4. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is .010".
FIGURE 31 – 44 PIN PLCC PACKAGE DIMENSIONS
SMSC DS – COM20051I
Page 74
Rev. 03/27/2000
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