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CPC7583BA View Datasheet(PDF) - Clare Inc => IXYS

Part Name
Description
MFG CO.
CPC7583BA
Clare
Clare Inc => IXYS Clare
'CPC7583BA' PDF : 21 Pages View PDF
3.1.3 CPC7583M
28-Lead DFN Package
11.0
(0.433)
7.0
(0.276)
0.33 +0.07,-0.05
(0.013 +0.003, -0.002)
Pin 1
0.90±0.10
(0.036 ±0.004)
0.55±0.10
(0.022±0.004)
0.20
(0.008)
7.5±0.05
(0.296±0.002)
0.02 +0.03, -0.02
(0.001 +0.0012, -0.001)
Seating Plane
NOTE: Because the metallic pad on the bottom of the
DFN package is connected to the substrate of the die,
Clare recommends that no printed circuit board traces
cross this area to avoid potential shorting issues.
CPC7583
Recommended PCB Land Pattern
0.75
(0.030)
5.0±0.05
(0.197±0.002)
6.70
(0.264)
1.05
(0.045)
Bottom side
metallic pad
Pin 1
0.75
(0.03)
0.35
(0.016)
Dimensions
mm
(inches)
R06
www.clare.com
19
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