CS2000-CP View Datasheet(PDF) - Cirrus Logic
Part Name
Description
MFG CO.
'CS2000-CP' PDF : 37 Pages View PDF
10.PACKAGE DIMENSIONS
CS2000-CP
10L MSOP (3 mm BODY) PACKAGE DRAWING (Note 1)
N
E
1 23
TOP VIEW
D
E1
c
A2
A
eb
A1
L
END VIEW
SIDE VIEW
SEATING
PLANE
L1
DIM
A
A1
A2
b
c
D
E
E1
e
L
L1
MIN
—
0
0.0295
0.0059
0.0031
—
—
—
—
0.0157
—
0°
INCHES
NOM
—
—
—
—
—
0.1181 BSC
0.1929 BSC
0.1181 BSC
0.0197 BSC
0.0236
0.0374 REF
--
MAX
0.0433
0.0059
0.0374
0.0118
0.0091
—
—
—
—
0.0315
—
8°
MIN
—
0
0.75
0.15
0.08
—
—
—
—
0.40
—
0°
MILLIMETERS
NOM
—
—
—
—
—
3.00 BSC
4.90 BSC
3.00 BSC
0.50 BSC
0.60
0.95 REF
—
MAX
1.10
0.15
0.95
0.30
0.23
—
—
—
—
0.80
—
8°
Notes: 1.
2.
3.
4.
5.
Reference document: JEDEC MO-187
D does not include mold flash or protrusions which is 0.15 mm max. per side.
E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side.
Dimension b does not include a total allowable dambar protrusion of 0.08 mm max.
Exceptions to JEDEC dimension.
THERMAL CHARACTERISTICS
Parameter
Symbol Min Typ Max
Junction to Ambient Thermal Impedance
JEDEC 2-Layer
JA
JEDEC 4-Layer
JA
Junction to Case Thermal Impedance
JC
Junction to Top Thermal Characteristic (Center of Package)
ΨJT
-
170
-
-
100
-
-
30.2
-
-
6
-
NOTE
4, 5
2
3
Units
°C/W
°C/W
°C/W
°C/W
DS761F3
35
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