CS4398CZZR View Datasheet(PDF) - Cirrus Logic
Part Name
Description
MFG CO.
'CS4398CZZR' PDF : 46 Pages View PDF
10.PACKAGE DIMENSIONS
10.1 28-TSSOP
N
CS4398
D
E11
E
A2
A
e
b2
SIDE VIEW
A1
SEATING
PLANE
1 23
TOP VIEW
DIM
MIN
A
--
A1
0.002
A2
0.03150
b
0.00748
D
0.378 BSC
E
0.248
E1
0.169
e
--
L
0.020
µ
0°
Inches
NOM
--
0.004
0.035
0.0096
0.382 BSC
0.2519
0.1732
0.026 BSC
0.024
4°
MAX
0.47
0.006
0.04
0.012
0.386 BSC
0.256
0.177
--
0.029
8°
MIN
--
0.05
0.80
0.19
9.60 BSC
6.30
4.30
--
0.50
0°
L
END VIEW
Millimeters
NOM
--
0.10
0.90
0.245
9.70 BSC
6.40
4.40
0.65 BSC
0.60
4°
MAX
1.20
0.15
1.00
0.30
9.80 BSC
6.50
4.50
--
0.75
8°
∝
Note
2,3
1
1
JEDEC #: MO-153
Controlling Dimension is Millimeters.
Figure 19. 28L TSSOP (4.4 mm Body) Package Drawing
Notes:
1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold mis-
match and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be 0.13 mm
total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not reduce dimen-
sion “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
THERMAL CHARACTERISTICS AND SPECIFICATIONS
Parameters
Symbol Min
Typ
Package Thermal Resistance (Note 4)
28-TSSOP θJA
θJC
-
37
-
13
4. θJA is specified according to JEDEC specifications for multi-layer PCBs.
Max Units
-
°C/Watt
-
°C/Watt
40
DS568F1
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