12 V
1.0 μF
CS5165
5.0 V
1200 μF/10 V × 3
0.1 μF
0.1 μF
330 pF
SS
VCC
COMP GATE(H)
COFF
VID4
VID3
GATE(L)
PGND
VID2
LGND
CS5165
VID1
VFB
VID0
PWRGD
ENABLE
IRL3103
1.2 μH
PCB trace
6.0 mΩ
1200 μF/10 V × 5
IRL3103
3.3 k
1000 pF
VCC
VSS
PWRGD
ENABLE
VID0 Pentium II
VID1
System
VID2
VID3
VID4
Figure 1. Application Diagram, 5.0 V to 2.8 V @ 14.2 A for 300 MHz Pentium II
ABSOLUTE MAXIMUM RATINGS*
Rating
Operating Junction Temperature, TJ
Lead Temperature Soldering:
Storage Temperature Range, TS
ESD Susceptibility (Human Body Model)
1. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
Value
Unit
0 to 150
°C
Reflow: (SMD styles only) (Note 1) 230 peak
°C
−65 to +150 °C
2.0
kV
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