CS5509
PACKAGE DIMENSIONS
16
9
16 pin
1
E1
8
Plastic DIP
DIM
A
A1
D
B
B1
C
S E A T IN G
A
D
PLANE
A1
L
∝C
E1
B1
e1
B
eA
e1
eA
L
∝
NOTES:
1. PO SITION AL TO LERANCE OF LEADS SHALL BE W ITHIN
0.13m m (0.005") AT M AXIM UM M ATERIAL CO NDITION, IN
RELATION TO SEATING PLANE AND EACH OTHER.
2. DIMENSION eA TO CENTER O F LEADS W HEN FORMED PARALLEL.
3. DIM ENSIO N E1 DO ES NO T INCLUDE M OLD FLASH.
M IL L IM E T E R S
INCHES
MIN NOM MAX MIN NOM MAX
3.94 - 5.08 0.155 - 0.200
0.51 - 1.02 0.020 - 0.040
0.38 0.46 0.53 0.015 0.018 0.021
0.89 1.27 1.65 0.035 0.050 0.065
0.20 0.25 0.38 0.008 0.010 0.015
18.93 19.43 19.93 0.745 0.765 0.785
6.10 6.35 6.60 0.240 0.250 0.260
2.41 2.54 2.67 0.095 0.100 0.105
7.62 - 8.25 0.300 - 0.325
3.18 - 3.81 0.125 - 0.150
0°
- 15° 0°
- 15°
pins
MILLIMETERS
INCHES
MIN NOM MAX MIN NOM MAX
16
9.91 10.16 10.41 0.390 0.400 0.410
20 12.45 12.70 12.95 0.490 0.500 0.510
24 14.99 15.24 15.50 0.590 0.600 0.610
D
28 17.53 17.78 18.03 0.690 0.700 0.710
E1 E
SOIC
DIM
A
A1
A2
MILLIMETERS
INCHES
MIN NOM MAX MIN NOM MAX
2.41 2.54 2.67 0.095 0.100 0.105
0.127 - 0.300 0.005 - 0.012
2.29 2.41 2.54 0.090 0.095 0.100
b
0.33 0.46 0.51 0.013 0.018 0.020
c 0.203 0.280 0.381 0.008 0.011 0.015
D
see table above
E 10.11 10.41 10.67 0.398 0.410 0.420
A2 A
c
e
b
A1
E 1 7.42 7.49 7.57 0.292 0.295 0.298
µ
e
1.14 1.27 1.40 0.040 0.050 0.055
L
0.41 - 0.89 0.016 - 0.035
L
µ
0°
- 8° 0° - 8°
22
DS125F2