CS82C37A-5 View Datasheet(PDF) - Harris Semiconductor
Part Name
Description
MFG CO.
'CS82C37A-5' PDF : 23 Pages View PDF
Die Characteristics
DIE DIMENSIONS:
148 x 159 x 19 ±1mils
(3760- x 4040 x 525µm)
METALLIZATION:
Type: SiAlCu
Thickness: Metal 1: 8kÅ ± 0.75kÅ
Thickness: Metal 2: 12kÅ ± 1.0kÅ
Metallization Mask Layout
82C37A
GLASSIVATION:
Type: Nitrox
Thickness: 10kÅ ± 3kÅ
WORST CASE CURRENT DENSITY:
0.6 x 105 A/cm2
82C37A
4-214
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