CS82C54-10 View Datasheet(PDF) - Harris Semiconductor
Part Name
Description
MFG CO.
'CS82C54-10' PDF : 17 Pages View PDF
Die Characteristics
DIE DIMENSIONS:
129mils x 155mils x 19mils
(3270µm x 3940µm x 483µm)
METALLIZATION:
Type: Si-Al-Cu
Metallization Mask Layout
82C54
Thickness: Metal 1: 8kÅ ± 0.75kÅ
Metal 2: 12kÅ ± 1.0kÅ
GLASSIVATION:
Type: Nitrox
Thickness: 10kÅ ± 3.0kÅ
82C54
D5
D6
D7
VCC WR
RD
D4
D3
D2
D1
D0
CLK0
CS
A1
A0
CLK2
OUT2
GATE2
OUT0 GATE0 GND
OUT1 GATE1 CLK1
4-17
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