CXA2021 View Datasheet(PDF) - Sony Semiconductor
Part Name
Description
MFG CO.
'CXA2021' PDF : 16 Pages View PDF
Package Outline
Unit: mm
22PIN SDIP (PLASTIC)
+ 0.4
19.2 – 0.1
22
12
1
11
1.778
CXA2021S
0° to 15°
0.5 ± 0.1
+ 0.15
0.9 – 0.1
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-22P-01
SDIP022-P-0300
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE WEIGHT
COPPER ALLOY
0.95g
– 16 –
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