CXP973F064 View Datasheet(PDF) - Sony Semiconductor
Part Name
Description
MFG CO.
'CXP973F064' PDF : 42 Pages View PDF
Package Outline
Unit: mm
75
76
100PIN LQFP (PLASTIC)
16.0 ± 0.2
∗ 14.0 ± 0.1
51
50
B
A
100
26 (0.22)
1
25
0.5
b
0.13 M
+ 0.2
1.5 – 0.1
0.1
0.1 ± 0.1
+ 0.08
b = 0.18 – 0.03
( 0.18 )
0˚ to 10˚
DETAIL B
DETAIL A
NOTE: Dimension "∗" does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
SONY CODE
EIAJ CODE
LQFP-100P-L01
P-LQFP100-14x14-0.5
LEAD TREATMENT
LEAD MATERIAL
SOLDER PLATING
42 / COPPER ALLOY
JEDEC CODE
PACKAGE MASS
0.7g
75
76
100PIN LQFP (PLASTIC)
16.0 ± 0.2
∗ 14.0 ± 0.1
51
50
B
A
100
26 (0.22)
1
25
0.5
b
0.13 M
+ 0.2
1.5 – 0.1
0.1
0.1 ± 0.1
+ 0.08
b = 0.18 – 0.03
( 0.18 )
0˚ to 10˚
DETAIL B
DETAIL A
NOTE: Dimension "∗" does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
SONY CODE
LQFP-100P-L01
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
P-LQFP100-14x14-0.5
LEAD MATERIAL
42 / COPPER ALLOY
JEDEC CODE
PACKAGE MASS
0.7g
LEAD SPECIFICATIONS
ITEM
SPEC.
LEAD MATERIAL
ALLOY 42
LEAD TREATMENT
Sn-Bi 2.5%
LEAD TREATMENT THICKNESS 5-18µm
– 41 –
CXP973F064
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