CYP15G0401DXB
CYV15G0401DXB
CYW15G0401DXB
Ordering Information
Speed
Standard
Standard
Standard
Standard
OBSAI
OBSAI
Standard
Standard
Standard
Standard
OBSAI
OBSAI
Ordering Code
CYP15G0401DXB-BGC
CYP15G0401DXB-BGI
CYV15G0401DXB-BGC
CYV15G0401DXB-BGI
CYW15G0401DXB-BGC
CYW15G0401DXB-BGI
CYP15G0401DXB-BGXC
CYP15G0401DXB-BGXI
CYV15G0401DXB-BGXC
CYV15G0401DXB-BGXI
CYW15G0401DXB-BGXC
CYW15G0401DXB-BGXI
Package
Name
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
Package Type
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Package Diagram
Operating
Range
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
A1 CORNER I.D.
TOP VIEW
27.00±0.13
1.57±0.175
0.97 REF.
0.20(4X)
A
B
BOTTOM VIEW (BALL SIDE)
Ø0.15 M C
Ø0.30 M C
AB
Ø0.75±0.15(256X)
A
24.13
20 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
R 2.5 Max (4X)
H
J
K
L
M
N
P
R
T
U
V
W
Y
0.50 MIN.
A
A1 CORNER I.D.
0.15 C
0.60±0.10
C
SIDE VIEW
26°
0.15 C
TYP.
SEATING PLANE
0.20 MIN
TOP OF MOLD COMPOUND
TO TOP OF BALLS
51-85123-*E
HOTLink is a registered trademark, and HOTLink II, and MultiFrame are trademarks, of Cypress Semiconductor. CPRI is a
trademark of Siemens AG. IBM and ESCON are registered trademarks, and FICON is a trademark, of International Business
Machines. All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-02002 Rev. *L
Page 51 of 53
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.