DPA425 View Datasheet(PDF) - Power Integrations, Inc
Part Name
Description
MFG CO.
DPA425
Power Integrations, Inc
'DPA425' PDF : 34 Pages View PDF
DPA422-426
PDIP-8 (P Package)
DIM
Inches
A 0.367-0.387
B 0.240-0.260
C 0.125-0.145
G 0.015-0.040
H 0.120-0.140
J1 0.057-0.068
J2 0.014-0.022
K 0.008-0.015
L
0.100 BSC
M 0.030 (MIN)
N 0.300-0.320
P
0.300-0.390
Q
0.300 BSC
mm
9.32-9.83
6.10-6.60
3.18-3.68
0.38-1.02
3.05-3.56
1.45-1.73
0.36-0.56
0.20-0.38
2.54 BSC
0.76 (MIN)
7.62-8.13
7.62-9.91
7.62 BSC
D S .004 (.10)
8
5
-E-
B
1
4
A
-D-
M
J1
N
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB for standard dual in-line
(DIP) package .300 inch row spacing (PLASTIC)
8 leads (issue B, 7/85).
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold flash
or other protrusions. Mold flash or protrusions G
shall not exceed .006 (.15) on any side.
4. D, E and F are reference datums on the molded
body.
L
C
H
J2
-F-
K
Q
P08A
P
PI-2076-040110
SMD-8 (G Package)
D S .004 (.10)
-E-
8
5
B
P
1
4
L
A
-D-
M
J1
J3
G08A
C
-F-
J4
α
J2 .010 (.25) M A S
.420
.046 .060 .060 .046
Pin 1
.080
.086
.186
.286
Solder Pad Dimensions
K
.004 (.10)
G
H
DIM
Inches
A
0.367-0.387
B 0.240-0.260
C
0.125-0.145
G
0.004-0.012
H
0.036-0.044
J1 0.057-0.068
J2 0.048-0.053
J3 0.032-0.037
J4
0.007-0.011
K
0.010-0.012
L
0.100 BSC
M
0.030 (MIN)
P
0.372-0.388
α
0-8°
mm
9.32-9.83
6.10-6.60
3.18-3.68
0.10-0.30
0.91-1.12
1.45-1.73
1.22-1.35
0.81-0.94
0.18-0.28
0.25-0.30
2.54 BSC
0.76 (MIN)
9.45-9.86
0-8°
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
4. D, E and F are reference datums on the
molded body.
PI-2077-040110
www.powerint.com
31
Rev. T 12/12
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