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DSPIC30F2011CT-20E/SP View Datasheet(PDF) - Microchip Technology

Part Name
Description
MFG CO.
DSPIC30F2011CT-20E/SP
Microchip
Microchip Technology Microchip
'DSPIC30F2011CT-20E/SP' PDF : 206 Pages View PDF
dsPIC30F2011/2012/3012/3013
2.3 Divide Support
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and
16/16-bit signed and unsigned integer divide opera-
tions, in the form of single instruction iterative divides.
The following instructions and data sizes are
supported:
1. DIVF - 16/16 signed fractional divide
2. DIV.sd - 32/16 signed divide
3. DIV.ud - 32/16 unsigned divide
4. DIV.s - 16/16 signed divide
5. DIV.u - 16/16 unsigned divide
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
The divide instructions must be executed within a
REPEAT loop. Any other form of execution
(e.g., a series of discrete divide instructions) will not
function correctly because the instruction flow depends
on RCOUNT. The divide instruction does not
automatically set up the RCOUNT value and it must,
therefore, be explicitly and correctly specified in the
REPEAT instruction, as shown in Table 2-1 (REPEAT
executes the target instruction {operand value+1}
times). The REPEAT loop count must be setup for 18
iterations of the DIV/DIVF instruction. Thus, a
complete divide operation requires 19 cycles.
Note:
The divide flow is interruptible. However,
the user needs to save the context as
appropriate.
TABLE 2-1: DIVIDE INSTRUCTIONS
Instruction
Function
DIVF
Signed fractional divide: Wm/Wn W0; Rem W1
DIV.sd
Signed divide: (Wm+1:Wm)/Wn W0; Rem W1
DIV.s
Signed divide: Wm/Wn W0; Rem W1
DIV.ud
Unsigned divide: (Wm+1:Wm)/Wn W0; Rem W1
DIV.u
Unsigned divide: Wm/Wn W0; Rem W1
DS70139F-page 22
© 2008 Microchip Technology Inc.
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