E-TDA7348D View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'E-TDA7348D' PDF : 20 Pages View PDF
Package information
5
Package information
TDA7348
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 6. SO-28 mechanical, data and package dimensions
DIM.
MIN.
mm
TYP. MAX.
MIN.
inch
TYP. MAX.
A
2.65
0.104
a1 0.1
0.3 0.004
0.012
b 0.35
0.49 0.014
0.019
b1 0.23
0.32 0.009
0.013
C
0.5
0.020
c1
45° (typ.)
D 17.7
18.1 0.697
0.713
E
10
10.65 0.394
0.419
e
1.27
0.050
e3
16.51
0.65
F
7.4
7.6 0.291
0.299
L
0.4
1.27 0.016
0.050
S
8 ° (max.)
OUTLINE AND
MECHANICAL DATA
SO-28
18/20
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