EC10DS4 View Datasheet(PDF) - Nihon Inter Electronics
Part Name
Description
MFG CO.
'EC10DS4' PDF : 5 Pages View PDF
AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE
Glass-Epoxy Substrate Mounted(Soldering Land=2×2mm)
1.2
EC10DS1/EC10DS2/EC10DS4
1.0 D.C.
HALF SINE WAVE
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (°C)
AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE
Alumina Substrate Mounted(Soldering Land=2×2mm)
1.6
EC10DS1/EC10DS2/EC10DS4
1.4
D.C.
1.2
1.0
HALF SINE WAVE
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (°C)
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