ECG006F-G View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'ECG006F-G' PDF : 4 Pages View PDF
ECG006F
InGaP HBT Gain Block
Mechanical Information
This This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible
with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a two-digit
numeric lot code (shown as “XX”) followed with a “7”
designator on the top surface of the package.
XX7
ESD / MSL Information
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device.
Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to
ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink.
Ensure that the ground / thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the region where
the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc Phone +1-503-615-9000 FAX: +1-503-615-8900 e-mail: info-sales@tqs.com Web site: www.TriQuint.com
Page 4 of 4 March 2012
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