EHP-A07 View Datasheet(PDF) - EVERLIGHT
Part Name
Description
MFG CO.
'EHP-A07' PDF : 15 Pages View PDF
EHP-A07/SUG01H-P01/TR
High Power LED – 1W
Precautions For Use
1. Over-current-proof
Although the EHP-A07 series has a conductive ESD protection mechanism, customer must
not use the device in reverse and should apply resistors for extra protection. Otherwise,
slight voltage shifts may cause significant current change resulting in burn out failure.
2. Storage
i. Do not open the moisture proof bag before the devices are ready to use.
ii. Before the package is opened, LEDs should be stored at temperatures less than 30℃
and humidity less than 90%.
iii. LEDs should be used within a year.
iv. After the package is opened, LEDs should be stored at temperatures less than 30℃and
humidity less than 60%.
v. LEDs should be used within 168 hours (7 days) after the package is opened.
vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have
exceeded the storage time, baking treatment should be implemented based on the
following conditions: pre-curing at 60±5℃ for 24 hours.
3. Thermal Management
i. For maintaining the high flux output and achieving reliability, EHP-A07 series LEDs
should be mounted on a metal core printed circuit board (MCPCB) or other kinds of
heat sink with proper thermal connection to dissipate approximately 1W of thermal
energy at 350mA operation.
ii. Heat dissipation or thermal conduction design is strongly recommended on PCB or
MCPCB for reflow soldering purposes. Please refer to soldering patterns on Page 2.
iii. Sufficient thermal management must be implemented. Otherwise, the junction
temperature of die may exceed over the limit at high current driving conditions and the
LEDs’ lifetime may be decrease dramatically.
iv. For further thermal management suggestions, please consult the Everlight Design
Guide or local representatives for assistance.
v. Special thermal designs are also recommended to take in outer heat sink design, such
as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal
conductive adhesive, etc.
vi. Sufficient thermal management must be conducted, or the die junction temperature will
be over the limit under large electronic driving and LED lifetime will decrease critically.
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