EHP-B05 View Datasheet(PDF) - EVERLIGHT
Part Name
Description
MFG CO.
'EHP-B05' PDF : 27 Pages View PDF
DATASHEET
EHP- B05 Series
5. Reflow Soldering Process
a. EHP-B05 series are suitable for SMT process
b. Curing of glue in oven according to standard operation flow processes.
300
tp
250
TL
200
150
100
ts
Preheat time
50
0
Time
Profile Feature
Ramp-UP Rate
Preheat Temperature
Preheat Time(ts)
Liquid Temperature(TL)
Time above TL
Peak Temperature(TP)
Peak Time(tp)
Ramp-Down Rate
Parameter
2-3 ℃/S
150-200℃
60~120s
217℃
60-90s
260±5℃(Varied with the solder material)
Max 20s
3-5 ℃/S
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
26 Copyright © 2011, Everlight All Rights Reserved. Release Date: 12.01.2011. Issue No: DHE-0001726
www.everlight.com
Revision : 3
Release Date:2012-04-02 19:22:39.0
LifecyclePhase:
Expired Period: Forever
Share Link: 
