EMC6D102-CZC View Datasheet(PDF) - SMSC -> Microchip
Part Name
Description
MFG CO.
EMC6D102-CZC
SMSC -> Microchip
'EMC6D102-CZC' PDF : 86 Pages View PDF
Fan Control Device with Hardware Monitoring and Acoustic Noise Reduction Features
Chapter 10 Mechanical Specifications
Datasheet
Figure 10.1 24-Pin SSOP Package Outline, 0.150 Wide Body, 0.025 Pitch
Table 10.1 24-pin SSOP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
0.053
A1
0.004
A2
~
D
0.337
~
0.069
~
0.010
~
0.061
~
0.344
Overall Package Height
Standoff
Body Thickness
X Body Size
E
0.228
~
0.244
E1
0.150
~
0.157
H
0.007
~
0.010
L
0.016
0.025
0.050
e
0.025 Basic
è
0o
~
8o
W
0.008
0.010
0.012
ccc
~
~
0.004
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Pitch
Lead Foot Angle
Lead Width
Coplanarity
Notes:
1. Controlling Unit: inch.
2. Tolerance on the true position of the leads is ± 0.0035 inches maximum.
3. Package body dimensions D and E1 do not include the mold protrusion. Maximum mold protrusion
is 0.006 inches for ends, and 0.010 inches for sides.
4. Dimension for foot length L measured at the gauge plane 0.010 inches above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 0.4 (04-05-05)
82
DATASHEET
SMSC EMC6D102
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