EMIF01-TV02F3 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF01-TV02F3' PDF : 7 Pages View PDF
EMIF01-TV02F3
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 9. Package dimensions
400 µm ± 40 µm
605 µm ± 55
0.89 mm ± 30 µm 255 µm ± 40
Figure 10. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening :
220 µm recommended
Figure 11. Marking
Doc ID 15320 Rev 3
5/7
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