EMIF02-MIC01F2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF02-MIC01F2' PDF : 7 Pages View PDF
EMIF02-MIC01F2
Ordering information
Figure 9. Footprint
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
Figure 10. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y ww
Figure 11. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.56
0.73 ± 0.05
All dimensions in mm
4 ± 0.1
User direction of unreeling
4
Note:
Ordering information
Table 3. Ordering information
Order code
Marking Package
EMIF02-MIC01F2
GB
Flip Chip
Weight
3.8 mg
Base qty
5000
Delivery mode
Tape and reel (7”)
More packing information is available in the application notes:
AN1235: “Flip Chip: package description and recommendations for use”
AN 1751: “EMI filters: Recomendations and measurements”
5/7
Share Link: 
