EMIF02-MIC02F1 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

EMIF02-MIC02F1

2 LINES EMI FILTER AND ESD PROTECTION

STMicroelectronics 

1 2 3 4 5 6

PACKAGE MECHANICAL DATA

FLIP CHIP

500µm ± 50

315µm ± 50

EMIF02-MIC02F1

650µm ± 65

1.07mm ± 50µm

FOOT PRINT RECOMMENDATIONS

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

MARKING

Dot, ST logo

xxx = marking

yww = datecode

(y = year

ww = week)

All dimensions in µm

365

240

xxx

y ww

5/6

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