EMIF02-MIC03C2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF02-MIC03C2' PDF : 7 Pages View PDF
Ordering information
Figure 12. Flip-Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
EMIF02-MIC03C2
Ø 1.5 ± 0.1
ST E
xxz
yww
ST E
xxz
yww
ST E
xxz
yww
0.73 ± 0.05
4 ± 0.1
All dimensions in mm
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
4
Ordering information
Ordering code Marking
EMIF02-MIC03C2 FW
Package
Flip-Chip
Weight
2.3 mg
Base qty
5000
Delivery mode
7” Tape and reel
5
Revision history
Date
28-Nov-2006
Revision
1
Initial release.
Changes
6/7
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