EMIF02-MIC06F3
2
Ordering information scheme
Ordering information scheme
Figure 11. Ordering information scheme
EMI filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: lead-free, pitch = 400 µm
EMIF yy - xxx zz Fx
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 12. Flip Chip package dimensions
400 µm ± 40
255 µm ± 40
605 µm ± 55
200 µm
1.20 mm ± 30 µm
Doc ID 15195 Rev 4
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