EMIF02-MIC07F3 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF02-MIC07F3' PDF : 8 Pages View PDF
Package information
3
Package information
EMIF02-MIC07F3
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Flip-Chip package dimensions
400 µm ± 40
255 µm ± 40
605 µm ± 55
185 µm
1.17 mm ± 30 µm
Figure 12. Footprint recommendations Figure 13. Marking
Copper pad Diameter:
220µm recommended
260µm maxim um
Solder mask opening:
300µm minimum
Solder stencil opening:
220µm recommended
Dot, ST logo
ECOPAK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
6/8
Doc ID 17052 Rev 3
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