EMIF03-SIM01F2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF03-SIM01F2' PDF : 7 Pages View PDF
EMIF03-SIM01F2
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Package dimensions
500 µm ± 50
315 µm ± 50
650 µm ± 65
210 µm
Figure 12. Footprint
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
1.42 mm ± 50 µm
Figure 13. Marking
Dot, ST logo
xx = marking
z = manufacturing
location
yww = datecode
(y = year
ww = week)
E
xxz
y ww
Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.52
0.73 ± 0.05
All dimensions in mm
4 ± 0.1
User direction of unreeling
5/7
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