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EMIF03-SIM02C2 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
EMIF03-SIM02C2
ST-Microelectronics
STMicroelectronics ST-Microelectronics
'EMIF03-SIM02C2' PDF : 8 Pages View PDF
1 2 3 4 5 6 7 8
EMIF03-SIM02C2
3-line IPAD™ EMI filter including ESD protection
Features
EMI symmetrical (I/O) low-pass filter
high efficiency in EMI filtering
lead-free coated package
very low PCB space occupation:
– 1.42 mm x 1.42 mm
very thin package: 0.65 mm
high efficiency in ESD suppression
high reliability offered by monolithic integration
high reduction of parasitic elements through
integration and wafer level packaging
Complies with following standards:
IEC 61000-4-2 level 4 on external and VCC
pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G - Method 3015-7 Class 3
Applications
Where EMI filtering in ESD sensitive equipment is
required:
SIM Interface (subscriber identify module)
UIM Interface (universal identify module)
Description
The EMIF03-SIM02C2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF03 Flip-Chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which protects the application from damage when
subjected to ESD surges up 15 kV.
TM: IPAD is a trademark of STMicroelectronics
Coated Flip-Chip package
(8 bumps)
Figure 1. Pin configuration (bump side)
321
RST RST
in
ext
A
CLK
in
Gnd
CLK
ext
B
Data
in
VCC
Data
ext
C
September 2010
Doc ID 13251 Rev 3
1/8
www.st.com
8
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