EMIF04-1502QCF View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF04-1502QCF' PDF : 6 Pages View PDF
EMIF04-1502QCF
Figure 9: QFN Package Mechanical Data
A3
See detail B
L
be
E
k
m
D2
D
A
A1
See detail A
b1 E2
m
Detail A
Detail B
L1
L1
L2
L2
REF.
A
A1
A3
b
b1
D
D2
E
E2
e
L
L1
L2
k
m
DIMENSIONS
Millimeters
Inches
Min. Typ. Max Min. Typ. Max.
0.50
1.00 0.020
0.039
0.00 0.03 0.05 0.00 0.001 0.002
0.25
0.010
0.18
0.30 0.007
0.012
0.17
0.44 0.007
0.017
1.90 2.00 2.10
0.079
0.88 0.98 1.08 0.035 0.039 0.043
1.90 2.00 2.10
0.079
0.46 0.56 0.65 0.018 0.022 0.026
0.50
0.020
0.20 0.29 0.45 0.008
0.018
0.15
0.006
0.13
0.005
0.20
0.008
0.12 0.17 0.23
Figure 10: Foot Print dimensions
(in millimeters)
0.98
1.01
Figure 11: Package marking
0.34
0.50
0.33
0.56 3.00
0.89
0.28
F4
Dot on package indicates Pin 1
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
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