EMIF04-EAR02M8 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF04-EAR02M8' PDF : 12 Pages View PDF
Recommendation on PCB assembly
5
Recommendation on PCB assembly
EMIF04-EAR02M8
5.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 20. Stencil opening dimensions
L
TW
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect
Ratio
=
W-----
T
≥ 1.5
Aspect Area
=
-------L-----×----W-----------
2T(L + W)
≥
0.66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 21. Recommended stencil window position
5 µm
5 µm
15 µm
T=100 µm
8/12
260 µm
120 µm
190 µm
200 µm
1320 µm
15 µm
50 µm
1080 µm
50 µm
120 µm
Footprint
Stencil window
Footprint
Doc ID 15508 Rev 2
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