EMIF06-10006F1 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF06-10006F1' PDF : 6 Pages View PDF
EMIF06-10006F1
ORDER CODE
EMIF yy - xxx zz F 1
EMI Filter
Pitch = 500µm
Bump = 315µm
Number of lines
FLIP CHIP
x: resistance value (Ω) z: capacitance value / 10 (pF)
or
application (3 letters) and version (2 digits)
PACKAGE MECHANICAL DATA
500µm ± 50
250µm ± 50
315µm ± 50
650µm ± 65
2.92mm ± 50µm
FOOT PRINT RECOMMENDATIONS
MARKING
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
Dot, ST logo
xxx = marking
yww = datecode
(y = year
ww = week)
All dimensions in µm
545
400
xxx
y ww
5/6
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