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EMIF09-SD01F3 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
EMIF09-SD01F3
ST-Microelectronics
STMicroelectronics ST-Microelectronics
'EMIF09-SD01F3' PDF : 8 Pages View PDF
1 2 3 4 5 6 7 8
EMIF09-SD01F3
9-line IPAD™, EMI filter and ESD protection
Features
9-line EMI low-pass filter and ESD protection
High efficiency in EMI filtering
Lead-free package
400 µm pitch
Very low PCB space occupation: < 4 mm2
Very thin package: 0.6 mm
High reliability offered by monolithic integration
Reduction of parasitic elements thanks to CSP
integration
Complies with the following standards
IEC61000-4-2 level 4 on external pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
IEC61000-4-2 level 2 on internal pins:
– 2 kV (air discharge)
– 2 kV (contact discharge)
MIL STD 883F - Method 3015.7 Class 3
Application
Secure digital memory card in mobile phones
and communication systems
Description
The EMIF09-SD01F3 is a highly integrated array
designed to suppress EMI/RFI noise for secure
digital memory cards. The EMIF09-SD01F3 is in
a Flip Chip package to offer space saving and
high RF performance.
This low-pass filter includes ESD protection
circuitry, which prevents damage to the protected
device when subjected to ESD surges up 15 kV.
This filter also has a low line capacitance to be
compatible with high data rate signals.
Flip Chip
24 bumps
Figure 1.
Pin layout (bump side)
54321
A
B
C
D
E
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 4
1/9
www.st.com
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