EP7309-CV-C View Datasheet(PDF) - Cirrus Logic

Part Name

Description

MFG CO.

EP7309-CV-C

High-Performance, Low-Power System on Chip Enhanced Digital Audio Interface

Cirrus Logic 

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Table T. 204-Ball TFBGA Ball List (Continued)

Die Pad Bond Pad Package Ball

Signal

Y1

GNDR

Y2

GNDR

Y3

GNDR

EP7309

High-Performance, Low-Power System on Chip

256-Ball PBGA Package Characteristics

256-Ball PBGA Package Specifications

Figure 13. 256-Ball PBGA Package

Note: 1) For pin locations see Table U.

2) Dimensions are in millimeters (inches), and controlling dimension is millimeter

3) Before beginning any new EP7309 design, contact Cirrus Logic for the latest package information.

DS507PP1

Copyright 2001 Cirrus Logic (All Rights Reserved)

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